Warp-Recovery: Printed Circuit Board Warping Correction Device
Eliminate defects in electronic component mounting by correcting the warping of printed circuit boards! An inline warping correction device that saves energy and space.
"Warp-Recovery" is a device that corrects warping that occurs during substrate manufacturing by passing it through a heated pressure roller and a pressure cooling roller. It corrects warping of printed circuit boards, eliminating manufacturing defects caused by warping. As chip components continue to miniaturize, this system will increasingly be required in both substrate manufacturing and component mounting. Additionally, we will be exhibiting at the 38th "Internepcon Japan Electronics Manufacturing and Assembly Exhibition" held at Tokyo Big Sight. We sincerely look forward to your visit. 【Features】 ■ Inline warping correction ■ Equipped with clean rollers to prevent dust and debris from being trapped ■ Space-saving design with a total installation length of 3m ■ Utilizes heated pressure rollers and pressure cooling rollers *For more details, please refer to the PDF materials or feel free to contact us.
- 企業：ダイナトロン
- 価格：Other
